Product description

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Product description

 

Wafer Edge Inspection System

Wafer Edge Inspection SystemRXW-1200
The automatic inspection equipment to detect and classify wafer edge defects as well as to measure the size of required parts in the Si wafer or device manufacturing process

Semiconductor Manufacturing Process
Edge Griding / Single Side Grinding / Double Side Polishing / Cleaning / Drying / Prime Water Final Inspection / Epitaxy, Silicon on Insulator / Deposition / Lithography / CMP / Edge Trimming / Pasting / Thining

Backside Macro Wafer Inspection System

Backside Macro Wafer Inspection SystemBMW-1200
The inspection equipment with high sensitive detection of deficiency / contamination of wafer back side and with three-dimensional sharp measurement of extracted defects in device manufacturing process

Semiconductor Manufacturing Process
Deposition / Lithography / Etching / CMP

Edge and front / back surface Inspection Equipment

Edge and Front / Back Surface Inspection EquipmentRXM-1200
The inspection equipment to detect various kinds of deficiency of water edge / both sides which occur is Si wafer manufacturing (Polishing / Epi) process

Semiconductor Manufacturing Process
Edge Griding / Single Side Grinding / Double Side Polishing / Cleaning / Drying / Prime Water Final Inspection / Epitaxy, Silicon on Insulator

Pinhole Defect Inspection Equipment

Pinhole Defect Inspection EquipmentRXP-1200
The automatic inspection equipment to detect pinhole defects using infrared light in the inside or on the back surface which occur in the Si crystal growth process

Semiconductor Manufacturing Process
Crystal Growth / Slicing / Single Side Grinding / Double Side Polishing / Prime Water Final Inspection

Silicon Crystal Deficiency Inspection Equipment

Silicon Crystal Deficiency Inspection Equipment BMD Analyzer MO-441 M2BMD Analyzer MO-441 M2
BMD Analyzer MO-471
BMD Analyzer MO-461 M2
The inspection equipment with high sensitive measurement of crystal deficiency density in the Si wafer, important to the manufacturing advanced device

Semiconductor Manufacturing Process
Crystal Growth / Slicing / Double Side Polishing

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LSTD Scanner

LSTD Scanner MO-601HS M2
The nondestructive inspection equipment to detect distributed defects of wafer surface on device active layer using laser light scattering and image measuring

Semiconductor Manufacturing Process
Crystal Growth / Slicing / Double Side Polishing / Prime Water Final Inspection

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